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RISNondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In high-density packaging technology, one of the most important issues is the reliability of the microjoints connecting large scale integrated circuit chips to printed circuit boards electrically ...
3D Shape Characterization and Image-Based DEM Simulation of the Lunar Soil Simulant FJS-1
Publisher: American Society of Civil Engineers
Abstract: This paper describes a procedure used to characterize the three-dimensional (3D) grain shape of lunar soil and undertake simulations of lunar soil by image-based discrete element method (DEM). Given that detailed 3D ...
Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: New nondestructive inspection methods with high spatial resolution are expected to support the evaluation and enhancement of the reliability of microjoints on printed circuit boards. An X-ray ...
Investigation of 3D Grain Shape Characteristics of Lunar Soil Retrieved in Apollo 16 Using Image-Based Discrete-Element Modeling
Publisher: American Society of Civil Engineers
Abstract: This paper describes three-dimensional (3D) grain shape characteristics of returned lunar soil (No. 60501) and its numerical simulation by using the image-based discrete-element method (DEM). First, the lunar soil sample ...