Abstract: The aim of the present paper is to investigate the two-dimensional moving contact behavior of piezomagnetic materials under the action of a sliding rigid punch. Introduction of the Galilean ...

Abstract: The purposes of the paper are to consider the failure phenomenon by delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process ...

Abstract: In this paper, analysis of the M-integral in plane elasticity is carried out. An infinite plate with any number of inclusions and cracks and with any applied forces and remote tractions is ...

Abstract: Previous studies assumed that a crack is either impermeable or permeable, which are actually two limiting cases of a dielectric crack. This paper considers the electroelastic problem of a ...

Abstract: The dynamic response of a penny-shaped crack in a three-dimensional piezoelectric ceramic strip under nonaxisymmetric normal mechanical and electrical impact loads is analyzed based on the continuous ...

Abstract: The purpose of this paper is to evaluate the delamination and fracture integrity of the integrated circuit (IC) plastic package under hygrothermal loading by the approaches of stress analysis ...

Abstract: This article investigates the structural stability of prismatic columns with elastically restrained ends under axial compressive force. An emphasis is placed on the analysis of the effect of Engesser’s and Haringx’s ...

Abstract: The interaction between a semi-infinite crack and a screw dislocation under antiplane mechanical and in-plane electrical loading in a linear piezoelectric material is studied in the framework of ...