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    Study on Machining Quality of Aluminum Honeycomb in Ultrasonic Cutting by Disc Cutter 

    Source: Journal of Manufacturing Science and Engineering:;2023:;volume( 145 ):;issue: 005:;page 51009-1
    Author(s): Sun, Jiansong; Kang, Renke; Guo, Jialin; Dong, Zhigang; Wang, Yidan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Aluminum honeycomb has been highlighted in aeronautics and astronautics in the form of the sandwich structure, but defects are easily generated during machining. Ultrasonic cutting for honeycomb material has received growing ...
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    Development and Optimization of Ultrasonic Elliptical Vibration Cutting Device Based on Single Excitation 

    Source: Journal of Manufacturing Science and Engineering:;2021:;volume( 143 ):;issue: 008:;page 081005-1
    Author(s): Yin, Sen; Dong, Zhigang; Bao, Yan; Kang, Renke; Du, Wenhao; Pan, Yanan; Jin, Zhuji
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A ultrasonic elliptical vibration cutting (UEVC) technique, as an advanced cutting method, has been successfully applied to machine difficult-to-cut materials for the last decade. In this study, the mechanism of the ...
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    Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal 

    Source: Journal of Manufacturing Science and Engineering:;2024:;volume( 146 ):;issue: 007:;page 71007-1
    Author(s): Xiang, Hongyi; Wang, Haoxiang; Kang, Renke; Gao, Shang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Surface roughness is a critical indicator to evaluate the quality of 4H-SiC grinding surfaces. Determining surface roughness experimentally is a time-consuming and laborious process, and developing a reliable model for ...
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    Influence of the Planetary Movement of Tool on the Aspect Ratio of Micro Holes Machined by Micro-Ultrasonic Machining 

    Source: Journal of Micro and Nano-Manufacturing:;2019:;volume( 007 ):;issue: 001:;page 10905
    Author(s): Lei, Senwang; Yu, Zuyuan; Zhou, Kai; Li, Jianzhong; Kang, Renke
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The micro-ultrasonic machining (USM) is suitable for machining hard and brittle materials. When a micro hole is drilled deeply using micro-USM, machining speed slows down and the breakage of micro tool may occur. To solve ...
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    Influence of the Planetary Movement of Tool on the Aspect Ratio of Micro Holes Machined by Micro-Ultrasonic Machining 

    Source: Journal of Micro and Nano-Manufacturing:;2019:;volume( 007 ):;issue: 001:;page 10905
    Author(s): Lei, Senwang; Yu, Zuyuan; Zhou, Kai; Li, Jianzhong; Kang, Renke
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: The micro-ultrasonic machining (USM) is suitable for machining hard and brittle materials. When a micro hole is drilled deeply using micro-USM, machining speed slows down and the breakage of micro tool may occur. To solve ...
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    A Novel Method of Blade-Inclined Ultrasonic Cutting Nomex Honeycomb Core With Straight Blade 

    Source: Journal of Manufacturing Science and Engineering:;2021:;volume( 143 ):;issue: 004:;page 041012-1
    Author(s): Wang, Yidan; Kang, Renke; Dong, Zhigang; Wang, Xuanping; Huo, Dehong; Zhang, Xun
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Ultrasonic cutting with a straight blade is an advanced method for cutting Nomex honeycomb cores. However, crushing has generally been observed on the machining surface of the honeycomb core during ultrasonic cutting (UC). ...
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    Why Parallelism of Workpieces Becomes Convergent During Double-Sided Lapping? 

    Source: Journal of Manufacturing Science and Engineering:;2023:;volume( 145 ):;issue: 007:;page 74501-1
    Author(s): Pan, Bo; Kang, Renke; Zhu, Xu; Yang, Zhe; Zhang, Juntao; Guo, Jiang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Double-sided lapping (DSL) is always employed as a precision process for machining flat workpieces, such as optical windows, wafers, and brake pads taking advantage of its high efficiency and parallelism. However, the ...
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    Material Removal Behavior of Ultrasonic Vibration Helical Grinding of SiCf/SiC Composites 

    Source: Journal of Manufacturing Science and Engineering:;2023:;volume( 145 ):;issue: 005:;page 51008-1
    Author(s): Dong, Zhigang; Zhang, Haitao; Bao, Yan; Yang, Feng; Wang, Zhongwang; Kang, Renke
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: To reveal the material removal mechanism of silicon carbide fiber reinforced silicon carbide ceramic matrix (SiCf/SiC) composites during the ultrasonic vibration helical grinding (UVHG) of hole-making process, a hole-making ...
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    Femtosecond Laser Two-Step Rotary Drilling Method for SiCf/SiC Composites 

    Source: Journal of Manufacturing Science and Engineering:;2025:;volume( 147 ):;issue: 003:;page 31010-1
    Author(s): Dong, Zhigang; Ma, Hongbin; Li, Zhaoji; Yang, Feng; Bao, Yan; Kang, Renke; Ma, Guangyi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A femtosecond laser method for high-quality and high-efficiency micro-hole fabrication of SiCf/SiC composites is proposed for this difficult-to-machine material. The influence of optical wedge parameters in the femtosecond ...
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    Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer 

    Source: Journal of Manufacturing Science and Engineering:;2018:;volume( 140 ):;issue: 012:;page 121001
    Author(s): Lin, Bin; Zhou, Ping; Wang, Ziguang; Yan, Ying; Kang, Renke; Guo, Dongming
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle ...
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