Abstract: Boiling can provide several orders of magnitude higher performance than a traditional air cooled system in electronics cooling applications. It can dissipate large quantities of heat while maintaining a low surface temperature ...

Abstract: The growing trend in miniaturization of electronics has generated a need for efficient thermal management of these devices. Boiling has the ability to dissipate a high heat flux while maintaining a small temperature ...

Abstract: Flow boiling in microchannels has been extensively studied in the past decade. Instabilities, low critical heat flux (CHF) values, and low heat transfer coefficients have been identified as the major shortcomings preventing ...