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    Simple Semi‐Loof Element for Analyzing Folded‐Plate Structures 

    Source: Journal of Engineering Mechanics:;1994:;Volume ( 120 ):;issue: 001
    Author(s): K. Y. Sze
    Publisher: American Society of Civil Engineers
    Abstract: This paper presents a simple semi‐Loof plate bending element. Unlike Irons' semi‐Loof element (reported in 1976), it is not necessary to construct any Kirchhoff‐constraint equations for the proposed element. The complementary ...
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    Cooling Rate Effect on Post Cure Stresses in Molded Plastic IC Packages 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 385
    Author(s): S. Yi; K. Y. Sze
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Residual stresses during cool down process after curing are evaluated on the basis of thermoviscoelastic finite element analyses with material properties dependent on both time and temperature. ...
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    Characterization of Notched Ductile Failure With Continuum Damage Mechanics 

    Source: Journal of Engineering Materials and Technology:;1990:;volume( 112 ):;issue: 004:;page 412
    Author(s): C. L. Chow; K. Y. Sze
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A recently developed anisotropic model of continuum damage mechanics has been applied successfully to characterize ductile fracture of cracked plates under mode I and mixed mode failures. The ...
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