Abstract: Cracks and rigid line inclusions, or anticracks, are commonly observed in many engineering materials, such as ceramics, intermetallics, etc. Interactions among these cracks and anticracks can ...

Abstract: The determination of the effective moduli for a material containing elliptical inclusions is the objective of this paper. This is done by incorporating an inclusion/matrix/composite model into a ...

Abstract: Materials, such as ceramics, intermetallics, and rocks, contain varying amounts of inhomogeneities, and the matrix material is vulnerable to microcracking in the neighborhood around these ...

Abstract: The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and ...

Abstract: Thin film metallizations are one of the most important interconnects in large-scale integrated circuits. They are covered by substrates and passivation films. Large hydrostatic (mean) tension ...

Abstract: Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis ...

Abstract: A model for crack nucleation in layered electronic assemblies under thermal cycling is developed in this paper. The present model includes three scales: (i) at the microscale or the mechanism ...