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    Wirebond Deformation During Molding of IC Packages 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001:;page 14
    Author(s): A. A. O. Tay; T. B. Lim; K. S. Yeo; J. H. Wu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: During the transfer molding of IC packages, wirebonds are deformed by the action of flow-induced viscous forces acting along them. Excessive deformation of wirebonds could give rise to short ...
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    Installation Stress in Prefabricated Vertical Drains 

    Source: Journal of Geotechnical and Geoenvironmental Engineering:;2003:;Volume ( 129 ):;issue: 009
    Author(s): G. P. Karunaratne; S. H. Chew; K. W. Leong; W. K. Wong; L. H. Lim; K. S. Yeo; A. M. Hee
    Publisher: American Society of Civil Engineers
    Abstract: Prefabricated vertical drains (PVDs) normally consist of a core and a filter (sleeve) made with polymeric materials. Modern installation rigs are capable of installing them at considerable speed in soft soil deposits. This ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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