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Wirebond Deformation During Molding of IC Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: During the transfer molding of IC packages, wirebonds are deformed by the action of flow-induced viscous forces acting along them. Excessive deformation of wirebonds could give rise to short ...
Installation Stress in Prefabricated Vertical Drains
Publisher: American Society of Civil Engineers
Abstract: Prefabricated vertical drains (PVDs) normally consist of a core and a filter (sleeve) made with polymeric materials. Modern installation rigs are capable of installing them at considerable speed in soft soil deposits. This ...