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    Energy-Release Rate in Elastic-Plastic Fracture Problems 

    Source: Journal of Applied Mechanics:;1981:;volume( 048 ):;issue: 004:;page 825
    Author(s): S. Aoki; K. Kishimoto; M. Sakata
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: It is shown that the energy-release rates associated with the translation, rotation, self-similar expansion and distortion of the fracture process region are expressed by the newly introduced ...
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    Crack-Tip Stress and Strain Singularity in Thermally Loaded Elastic-Plastic Material 

    Source: Journal of Applied Mechanics:;1981:;volume( 048 ):;issue: 002:;page 428
    Author(s): S. Aoki; K. Kishimoto; M. Sakata
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Use of Ĵ-Integral in Dynamic Analysis of Cracked Linear Viscoelastic Solids by Finite-Element Method 

    Source: Journal of Applied Mechanics:;1982:;volume( 049 ):;issue: 001:;page 75
    Author(s): K. Kishimoto; S. Aoki; M. Sakata
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A computational method using the path (area)-independent Ĵ-integral is developed to analyze viscoelastic problems. Since the displacement field near the crack tip of a viscoelastic solid is ...
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    Crack Growth and Instable Fracture of Rotating Disks 

    Source: Journal of Engineering Materials and Technology:;1985:;volume( 107 ):;issue: 002:;page 154
    Author(s): M. Sakata; M. Kanzawa; N. Ogure; S. Aoki; K. Kishimoto
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The fracture of rotating disks that have cracks and/or notches is predicted employing the crack instability criterion based on the J-integral R-curve approach characterizing a material resistance ...
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    Fatigue Life Estimation of Solder Joints in SMT-PGA Packages 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 002:;page 207
    Author(s): Y. Hiruta; K. Takahashi; K. Kishimoto; M. Mukai; T. Kawakami; T. Shibuya
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The fatigue life estimation of solder joints is one of the most critical requirements in the development of reliable electronic components. In this study, we first examined a constitutive model ...
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