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    Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003:;page 220
    Author(s): K. J. Zwick; P. S. Ayyaswamy; I. M. Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this part the heat, mass, and momentum transfer within a curing over that is commonly used in microelectronic manufacturing have been numerically analyzed. The local partial pressure of the ...
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    Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003:;page 215
    Author(s): K. J. Zwick; I. M. Cohen; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A curing oven that is commonly used in microelectronic manufacturing has been analyzed to determine the causes of contamination of parts passing through the oven, and to eliminate this ...
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