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    Computational Heat Transfer 

    Source: Journal of Pressure Vessel Technology:;1987:;volume( 109 ):;issue: 002:;page 262
    Author(s): Y. Jaluria; K. E. Torrance
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Thermal Analysis and Optimization of Substrates With Directionally Enhanced Conductivities 

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001:;page 64
    Author(s): K. K. Sikka; T. S. Fisher; K. E. Torrance
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An approximate analytical solution for the thermal resistance of the axisymmetric chip-on-substrate problem is presented for a substrate with a direction dependent (orthotropic) thermal conductivity. ...
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    Experiments on Chimney-Enhanced Free Convection From Pin-Fin Heat Sinks 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 004:;page 350
    Author(s): W. W. Thrasher; T. S. Fisher; K. E. Torrance
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experimental results for thermal systems consisting of pin-fin heat sinks situated below chimneys are presented. System-level heat transfer and porosity optimization results are compared with ...
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    A Short Comparison of Damping Functions of Standard Low-Reynolds-Number k-ε Models 

    Source: Journal of Fluids Engineering:;1997:;volume( 119 ):;issue: 002:;page 460
    Author(s): A. N. Rousseau; L. D. Albright; K. E. Torrance
    Publisher: The American Society of Mechanical Engineers (ASME)
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