Abstract: A three-dimensional elasticity solution to the vibrations of stress-free hollow cylinders of arbitrary cross section is presented. The natural frequencies and deformed mode shapes of these cylinders ...

Abstract: A comprehensive investigation on free vibration of three-dimensional elastic solids of rectangular planform is reported. The continuum is considered to be free from normal and in-plane stresses ...

Abstract: A procedure is presented for determining the three-dimensional elasticity solutions for free vibration analysis of simply supported thick skew plates. The exact expressions of strain and kinetic ...

Abstract: This paper presents an investigation on free vibration of thick prismatic structures (thick-walled open sections of L, T, C, and I shapes). The derivation of a linear frequency equation based ...

Abstract: The application of underfill materials to fill up the room between the chip and substrate is known to substantially improve the thermal fatigue life of flip chip solder joints. Nowadays, no-flow ...

Abstract: Flip chip is the emerging interconnect technology for the next generation of high performance electronics. To eliminate the process bottlenecks associated with flip chip assembly, a new assembly ...