Abstract: The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying ...

Abstract: A geometrically nonlinear curved‐beam finite element is derived and is applied to the load‐deflection and buckling analysis of shallow and deep arches. The element stiffness properties are derived relative to a moving ...