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RISThermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling ...