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Temperature Dependence of the Mechanical Properties of GaAs Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: GaAs is known to have superior electronic properties and greater photovoltaic conversion efficiency compared to elemental semiconductors such as silicon and germaniumn. Mechanical properties of ...
A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wire bond connections are susceptible to fatigue failure as a result of various thermo-mechanical damage mechanisms during the component operation life. Because of uncertainties arising from the ...