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RISQuantitative Interfacial Energy Measurements of Adhesion-Promoted Thin Copper Films by Supercritical Fluid Deposition on Barrier Layers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A fivefold increase in adhesion energy is observed for poly(acrylic acid) (PAA) modified Cu/TaN interfaces in which the thin copper films are deposited by the hydrogen assisted reduction of ...