Search
CSV
RISNondestructive Photoelastic and Machine Learning Characterization of Surface Cracks and Prediction of Weibull Parameters for Photovoltaic Silicon Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A nondestructive photoelastic method is presented for characterizing surface microcracks in monocrystalline silicon wafers, calculating the strength of the wafers, and predicting Weibull parameters under various loading ...