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RISExperimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40°C, 23°C, and 125°C
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The objective of this work was to experimentally determine the in situ creep behavior and constitutive model equations for a commercial area array package and printed wiring board assembly at ...