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    A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003:;page 31012
    Author(s): Matthew Sweetland; John H. Lienhard V; Alexander H. Slocum
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Active control of die-level temperature is required during production testing of high power microprocessors in order to ensure accurate performance classification, but control is becoming more ...
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