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    Factors Affecting the Operational Thermal Resistance of Electronic Components 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003:;page 185
    Author(s): Mark R. D. Davies; John Lohan; Reena Cole
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermal resistance of electronic components is known to often differ considerably between standard test conditions and those found in service. One way to correct for this is to use ...
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