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    A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 004:;page 41002
    Author(s): Chuen-Ching Wang; Wen-Ran Yang; Jin-Jia Chen; Wei-Wen Shi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The explosive growth in the use of the Internet and multimedia applications in both the home and the office has fueled the requirement for high-bandwidth communication systems capable of ...
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    DSpace software copyright © 2002-2015  DuraSpace
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian