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RISEffects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nonconductive film (NCF) is a challenging potential material to substitute the application of anisotropic conductive film in the ultrafine pitch chip-on-glass (COG) packaging. The NCF interconnection ...
Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nonconductive film (NCF) interconnection technology is now being used for the ultrafine pitch interconnections in chip-on-glass (COG) packaging. In comparison to traditional anisotropic conductive ...
Attack–Defense Game in Interdependent Networks: A Functional Perspective
Publisher: ASCE
Abstract: The normal operation of critical infrastructure is related to the stability of society and a country’s development. Based on game theory and network science, this paper analyzes the attack–defense issues of critical ...
A 10-Year Climatology of Mesoscale Convective Systems and Their Synoptic Circulations in the Southwest Mountain Area of China
Publisher: American Meteorological Society
Modeling the Vulnerability and Resilience of Interdependent Transportation Networks under Multiple Disruptions
Publisher: American Society of Civil Engineers
Abstract: Because infrastructure systems are highly interconnected, it is crucial to analyze their vulnerability and resilience with the consideration of interdependencies. This paper constructed a bus–metro interdependent network ...