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Measurement and Characterization of the Moisture-Induced Properties of ACF Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study is to observe the exact behavior of anisotropic conductive adhesion (ACF) package under humid environments by obtaining the moisture-induced properties such as diffusion coefficient ...
Effect of Shield-Can on Dynamic Response of Board-Level Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In order to protect the electronic components of electronic devices on a printed circuit board (PCB) against electromagnetic radiation, a conductive shield-can or box is normally attached to the ...
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