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RISValidation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A general fatigue life prediction methodology, based on a unified creep plasticity damage (UCPD) model, was developed for predicting fatigue cracks in 95.5Sn–3.9Ag–0.6Cu (wt %) solder interconnects. ...