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RISEffect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plane two-dimensional finite element analysis was applied to study the effect of underfill thermomechanical properties on the potential of thermal fatigue failure for flip-chip ball grid array. ...
Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tin∕Al–NiV–Cu Under bump metallization (UBM) and packages of pure tin∕Al–NiV–Cu UBM/substrate ...