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Spatially Resolved Characterization of Residual Stress Induced by Micro Scale Laser Shock Peening
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Single crystal aluminum and copper of (001) and (110) orientation were shock peened using laser beam of 12 micron diameter and observed with X-ray micro-diffraction techniques based on a ...
Systematical Characterization of Material Response to Microscale Laser Shock Peening
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The response of materials after microscale laser shock peening (μLSP) was experimentally characterized and compared with the theoretical prediction from FEM analysis in microlength level. Since ...
Spatially Resolved Characterization of Geometrically Necessary Dislocation Dependent Deformation in Microscale Laser Shock Peening
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the laser spot size in microscale laser shock peening is in the order of magnitude of several microns, the anisotropic response of grains will have a dominant influence on its mechanical ...
Dynamic Material Response of Aluminum Single Crystal Under Microscale Laser Shock Peening
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The process of laser shock peening induces compressive residual stresses in a material to improve material fatigue life. For micron sized laser beams, the size of the laser-target interaction ...
Characterization of Plastic Deformation Induced by Microscale Laser Shock Peening
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electron backscatter diffraction (EBSD) is used to investigate crystal lattice rotation caused by plastic deformation during high-strain rate laser shock peening in single crystal aluminum and ...
Structure and Properties of Electrocodeposited Cu–Al2O3 Nanocomposite Thin Films
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Nanocomposite thin films which consist of 50nmAl2O3 nanoparticles in a copper metal matrix were deposited on a silicon wafer. The thickness of the nanocomposite thin films was about 3microns ...
Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Micro-scale laser shock peening (μLSP) can potentially be applied to metallic structures in microdevices to improve fatigue and reliability performance. Copper thin films on a single-crystal silicon ...
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