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Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased ...
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested ...
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