Abstract: Defense Advanced Research Project Agency's (DARPA's) thermal ground plane (TGP) effort was aimed at combining the advantages of vapor chambers or twodimensional (2D) heat pipes and solid conductors by building thin, high ...

Abstract: Thermal interface materials (TIMs) have reached values approaching the measurement uncertainty of standard ASTM D5470 based testers of approximately آ±1 أ— 10−6 m2 K/W. This paper presents a miniature ASTMtype ...