Abstract: Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual ...

Abstract: This paper presents the bending analysis of a simply supported, thick skew plate based on the first-order shear deformation Reissner/Mindlin theory. Using the geometric transformation, the governing differential equations ...

Abstract: In this paper, the axisymmetric bending analysis of moderately thick circular plates based on the Reissner-Mindlin plate theory is conducted numerically by using the differential quadrature (DQ) method. The governing ...

Abstract: A numerical solution technique, which is based on the differential quadrature method, is presented for investigation of the static characteristics of thick Reissner/Mindlin plates on quandrangular planforms. The basic idea ...

Abstract: The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study ...