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RISPrediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal performance of a three chip, overmolded wire-bonded plastic ball grid array (WB-PBGA) package with four layer substrate attached to a 1.52-mm-thick, four-layer (2s2p), FR4 printed wiring ...