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    Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001:;page 27
    Author(s): G. L. Lehmann; J. Pembroke
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Forced convection air cooling of an array of low profile, card-mounted components has been investigated. A simulated array is attached to one wall of a low aspect ratio duct. This is the ...
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    Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 1—Base Case 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001:;page 21
    Author(s): G. L. Lehmann; J. Pembroke
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Forced convection cooling of a simulated array of card-mounted electronic components has been investigated. An important feature of the simulated components is their relatively low profile ...
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