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Response Surface Modeling for Nonlinear Packaging Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize ...
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigates the effect of the anisotropic behavior of the die and the time- and temperature-dependent behavior of epoxy molding compound on the packaging induced stresses for a quad ...