Search
Now showing items 1-3 of 3
Thermally Induced Failure of Microelectronic Structures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The purpose of this paper is to perform a theoretical evaluation to assess mechanical failure of an idealized two-dimensional, narrow, thin microelectronic structure, modelled as a plate, composed ...
Mechanical Alignment Using Duplicate Circular Wedges
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There is a need for the repeatable, accurate, precise and versatile alignment of mechanical components. A flexible and inexpensive approach to this problem is the use of a duplicate pair of ...
A Least-Squares Approach to the Practical Use of the Hole Method in Photoelasticity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The use of a small circular hole in elastostatic photoelasticity to determine the stress tensor for any two-dimensional general loading situation is well known. The original application required ...
CSV
RIS