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    Thermally Induced Failure of Microelectronic Structures 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001:;page 80
    Author(s): J. F. Cardenas-Garcia; M. C. Chyu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The purpose of this paper is to perform a theoretical evaluation to assess mechanical failure of an idealized two-dimensional, narrow, thin microelectronic structure, modelled as a plate, composed ...
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    Mechanical Alignment Using Duplicate Circular Wedges 

    Source: Journal of Mechanical Design:;1999:;volume( 121 ):;issue: 002:;page 305
    Author(s): J. F. Cárdenas-García; W. E. Ingalls; K. P. Suryanarayan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There is a need for the repeatable, accurate, precise and versatile alignment of mechanical components. A flexible and inexpensive approach to this problem is the use of a duplicate pair of ...
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    A Least-Squares Approach to the Practical Use of the Hole Method in Photoelasticity 

    Source: Journal of Applied Mechanics:;1997:;volume( 064 ):;issue: 003:;page 576
    Author(s): J. F. Cardenas-Garcia; A. J. Durelli; Y. L. Tian; J. Hashemi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The use of a small circular hole in elastostatic photoelasticity to determine the stress tensor for any two-dimensional general loading situation is well known. The original application required ...
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