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Cooling of Power Electronics by Embedded Solids
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal issues have become a major consideration in the design and development of electronic components. In power electronics, thermal limitations have been identified as a barrier to future ...
Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding ...