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    Cooling of Power Electronics by Embedded Solids 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 388
    Author(s): J. Dirker; J. D. van Wyk; J. P. Meyer
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal issues have become a major consideration in the design and development of electronic components. In power electronics, thermal limitations have been identified as a barrier to future ...
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    Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001:;page 1
    Author(s): Y. Pang; J. D. van Wyk; Z. Liang; E. Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding ...
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