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RISCreep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The paper presents a study of creep behavior of a printed wiring board caused by the mechanical fastening of separable connector, known as a land grid array. Time-temperature superposition ...
Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The paper presents a study on printed wiring board (PWB) warpage caused by the mechanical fastening of separable interconnects, known as land grid array (LGA) package assemblies. Out-of-plane ...