Abstract: Flip chip assemblies used in electronic packaging consist of three main components (layers): chip, underfill, and substrate. In this paper, the flip chip assembly is represented as a bi-material ...

Abstract: We study stresses and fracture due to temperature change in a flip-chip assembly at the chip/underfill interface for various thermo-mechanical properties of underfill and the device’s geometry. ...

Abstract: We study apparent elastic moduli of trabecular bone, which is represented, for simplicity, by a two- or three-dimensional periodic cellular network. The term “apparent” refers to the case when ...