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RISEffects of Orientation on Critical Heat Flux From Chip Arrays During Flow Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Boiling experiments were performed with FC-72 on a series of nine in-line simulated microelectronic chips in a flow channel to ascertain the effects of channel orientation on critical heat flux ...
Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A high power electronic chip was simulated experimentally to investigate upper cooling capabilities using a variety of pool boiling enhancement techniques. Parametric effects of system pressure, ...
Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Increased rate of heat dissipation from electronic chips was explored by the application of flow boiling in mini-channel (D = 2.54 mm) and micro-channel (D = 510 μm) heat sinks with special ...
Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A high flux electronic chip was numerically and experimentally simulated to investigate pool boiling capabilities of enhanced metallic surface attachments built upon a 12.7 × 12.7 mm2 base ...
Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effects of chip protrusion on the forced-convection boiling and critical heat flux (CHF) of a dielectric coolant (FC-72) were investigated. The multi-chip module used in the present study ...