Search
CSV
RISMechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Interface degradation between dissimilar materials in the flip chip packages with anisotropic conductive adhesive joint is susceptible to mechanical and electrical failure upon temperature cycling. ...