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RISSingle Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Single-phase liquid cooling in microchannels and microgaps has been successfully demonstrated for heat fluxes of ∼1 kW/cm2 for silicon chips with maximum temperature below 100 °C. However, effectively managing localized ...
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation ...