Search
Now showing items 1-4 of 4
Quantum Dots Converted Light Emitting Diodes Packaging for Lighting and Display: Status and Perspectives
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent years, semiconductor quantum dots (QDs) have attracted tremendous attentions for their unique characteristics for solidstate lighting (SSL) and thinfilm display applications. The pure and tunable spectra of QDs make ...
Physics-Informed Proper Orthogonal Decomposition for Accurate and Superfast Prediction of Thermal Field
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal field prediction has garnered ever-increasing attention as an urgent and vital issue in broad applications ranging from thermal management, performance prognosis, lifetime evaluation, and safety assessment, to ...
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and ...