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RISEvaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The microstructure transformation, mechanical properties, and fracture behavior of boron (B) decorated tin (Sn)-1.5%Ag-0.7%copper (Cu) (SAC157) solder joints with Cu pillars were analyzed. Three concentrations of B (0.015%, ...