Abstract: In flip chip packages, it is common practice for interconnects to be encapsulated with a liquid underfill material. This paper describes the effects of different underfill processes, i.e., the ...

Abstract: This paper describes the “thermal opening technique” for enhancing the ultrasonic response of a tightly closed crack. In this approach, thermal stress is generated by cooling the part locally ...

Abstract: This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins and the ...