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RISOnset of Wiggling in a Microscopic Patterned Structure Induced by Intrinsic Stress During the Dry Etching Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In semiconductor devices, fine patterning can cause structural instability because of intrinsic compressive stress. We studied one such instability phenomenon, outofplane wiggling of a patterned structure with mask–dielectric ...