Abstract: With the development of semiconductor technology, traditional flip-chip bonding has been difficult to meet the high-density, high-reliability requirements of advanced packaging technology. As an advanced three-dimensional ...

Abstract: Bulk flow methods for circumferentially grooved seals use simplified physics models to predict leakage and rotordynamic coefficients efficiently, but uncertainty in empirical quantities like friction factors and loss ...

Abstract: To compensate for an extremely heavy journal, jacking pockets can be added to the surface of pads in fluid film bearings. Jacking pockets can range in size and shape and will have an influence on the hydrodynamic performance ...