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RISAging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Relationships between microstructural and mechanical aging effects in eutectic PbSn and Pb-free solder alloy Sn3.9Ag0.6Cu are reported and compared. The room temperature aged Sn3.9Ag0.6Cu alloy ...