Abstract: A systematic multidisciplinary electronics packaging design and optimization methodology, which takes into account the complexity of multiple design trade-offs, operated in conjunction with the ...

Abstract: Although thermal performance is always a critical issue in electronic packaging design at every packaging level, there is a significant lack of reliable and efficient thermal modeling and analysis ...

Abstract: A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) is presented. The methodology includes thermal, electrical, and ...

Abstract: Electronics packaging design is a process that requires optimized solutions based on multidisciplinary design trade-offs, which usually have complex relationships among multiple design variables. ...

Abstract: The p-type perovskite oxides La1-x Srx CoO3 are a promising group of complex oxide thermoelectric materials because of its higher Seebeck coefficient. In this paper, the La0.95 Sr0.05 CoO3 thin ...