Abstract: The plane elastic problem for a periodic array of cracks in a half-plane subjected to equal, but otherwise arbitrary normal crack surface tractions is examined. The mixed boundary value problem, ...

Abstract: In this study, finite element models are developed to analyze and predict the transient temperature profiles, residual stresses, and distortion incurred during deposition of protective overlay ...

Abstract: This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between ...

Abstract: This paper examines the phenomenology of the large strain, post-yield behavior of the three thermoplastics—polycarbonate, polybutylene terephthalate and polyetherimide—from the point of view of the ...

Abstract: The detailed mechanical behavior to yield of three thermoplastics—polycarbonate, polybutylene terephthalate, and polyetherimide—subjected to simulated forming histories, is examined in order to gain ...

Abstract: Cracking and delamination at the interfaces of different materials in plastic IC packages is a well-known failure mechanism. The investigation of local stress behavior, including characterization ...

Abstract: This paper describes a combined numerical and experimental approach to the development of a software package for simulating the thermoforming process. In this process thin polymer sheets are ...