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An Approach to Modeling Cutting Forces in Five-Axis Ball-End Milling of Curved Geometries Based on Tool Motion Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The prediction of five-axis ball-end milling forces is quite a challenge due to difficulties of determining the underformed chip thickness and engaged cutting edge. To solve these concerns, this ...
Generation Mechanism and Quality of Milling Surface Profile for Variable Pitch Tools Considering Runout
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Surface profile is one of the foremost aspects to evaluate milling performance. Its generation mechanism is affected by a variety of factors such as tool geometry, runout values, and process parameters and thus still ...
A Global Correction Process for Flat Optics With Patterned Polishing Pad
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: To improve the efficiency of flat optics fabrication, a global correction method with the patterned polishing pad is developed in this paper. Through creating grooves on a polishing pad, the contact pressure distribution ...
Prediction of Surface Profile Evolution of Workpiece and Lapping Plate in Lapping Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lapping has a history of hundreds of years, yet it still relies on the experience of workers. To improve the automaticity and controllability of the lapping process, a modeling method of friction and wear is developed to ...
Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle ...
Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Subsurface damage (SSD) and grinding damage-induced stress (GDIS) are a focus of attention in the study of grinding mechanisms. Our previous study proposed a load identification method and analyzed the GDIS in a silicon ...