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    Advances in Bonding Technology for Electronic Packaging 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002:;page 201
    Author(s): Chin C. Lee; Chen Y. Wang; Goran Matijasevic
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Recent progress in bonding materials is briefly reviewed with highlights of some of the advantages and disadvantages of the various attachment processes. The principle and experimental results ...
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