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    A Vapotron Effect Application for Electronic Equipment Cooling 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004:;page 475
    Author(s): Giulio Lorenzini; Cesare Biserni
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This research is aimed at investigating by experimental means a possible use of the Vapotron Effect for the cooling of electronic devices. The problem deals with a particular kind of subcooled ...
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    A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003:;page 324
    Author(s): Giulio Lorenzini; Simone Moretti
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The problem of heat removal in energetic processes represents a big challenge especially because of the enhanced requirements of the modern industry. The thermal exchange systems therefore have ...
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    Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 003:;page 31012
    Author(s): Giulio Lorenzini; Simone Moretti
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal conductance and loss of pressure are among the most relevant parameters based on which a heat exchanger has to be chosen. Starting from this observation this study treated and compared ...
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    A Bejan’s Constructal Theory Approach to the Overall Optimization of Heat Exchanging Finned Modules With Air in Forced Convection and Laminar Flow Condition 

    Source: Journal of Heat Transfer:;2009:;volume( 131 ):;issue: 008:;page 81801
    Author(s): Giulio Lorenzini; Simone Moretti
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Optimizing ever smaller heat exchangers determines two opposite needs: augmenting performances, on the one hand; removing heat in excess to reduce failures, on the other. This numerical study, ...
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    Numerical Heat Transfer Optimization in Modular Systems of Y-Shaped Fins 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 008:;page 81801
    Author(s): Giulio Lorenzini; Simone Moretti
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper analyses the heat exchange behavior in systems characterized by Y-shaped fins through a numerical approach based on a CFD software. Starting from individual Y profiles, as optimized ...
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    Bejan’s Constructal Theory Analysis of Gas-Liquid Cooled Finned Modules 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 007:;page 71801
    Author(s): Giulio Lorenzini; Simone Moretti
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: High performance heat exchangers represent nowadays the key of success to go on with the trend of miniaturizing electronic components as requested by the industry. This numerical study, based ...
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    Constructal Design of Complex Assembly of Fins 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 008:;page 81902
    Author(s): Giulio Lorenzini; Roberta Lima Corrêa; Elizaldo Domingues dos Santos; Luiz Alberto Oliveira Rocha
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Constructal design is a method that conducts the designer toward flow (e.g., heat flux) architectures that have greater global performance. This numerical work uses this method to seek for the ...
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    Constructal Design of Cavities Inserted Into a Cylindrical Solid Body 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 007:;page 71301
    Author(s): Giulio Lorenzini; Luiz Alberto Oliveira Rocha; Cesare Biserni; Elizaldo Domingues dos Santos; Liércio André Isoldi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper considers the numerical optimization of the shape of cavities that intrude into a cylindrical solid body. The objective is to minimize the global thermal resistance between the solid ...
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