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RISFabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work will specifically detail the development of a processing and fabrication route for a three-dimensional asynchronous field-programmable gate array (3D-AFPGA) design based on an extension of pre-existing ...